3D Anisotropic-Etching Simulator FabMeister-ES
Simulation Results
(1)Pen-shaped needle(100 wafer, KOH solution, temperature is 70 degrees centigrade)
Step structure formed by dicing.
(Picture of Sikida at Nagoya University.)
Expermental results of pen-shaped needle
(Picture of Sikida at Nagoya University.)
Simulation result of MICROCAD(click to see this animation)
(2)Micro-channel(100 wafer, KOH solution, temperature is 80 degrees centigrade)
Compensation mask pattern design for mask corners
Simulation result(click to see this animation)
(3)From vertical etched form(100 wafer, KOH solution, temperature is 40 degrees centigrade)
3D wire frame
Cross-section of initial shape
Simulation result(click to see this animation)
(4)Etching stop layer(110 wafer, KOH solution, temperature is 80 degrees centigrade)
The green layer is etching stop layer.
Simulation result(click to see this animation)
Contact
Department:Science Solutions Division
TEL:+81-3-5281-5310
